Laser Drilling systems optimized for conventional and high performance materials, advanced packaging, and embedded components
Blind and through-hole via drilling
Cutting, routing, and circuit excising
Skiving / cavity formation
Defect repair
Systems to suit any material and construction
ProVia-H
Dual-laser (UV + CO2) system, providing the broadest capability with optimum speed
ProVia-C
High repetition rate, high peak power CO2 laser for drilling and cutting dielectric material
ProVia-UV
High power UV laser for superior drilling and cutting quality
Optional Features and Hardware
Autoloader
Complete automation allows for trays of panels to be loaded into the system (side pods shown above and detail left). Panels are loaded by vacuum pickup.
Automatic Run-time Calibration means no operator intervention is required for an entire batch.
Slipsheet pass through handling
Networking software with automatic file retrieval and job creation
The system can even accommodate a tray of mixed panels, using optional OCR or barcode to read panel ID and load the appropriate job from files on the system or network.
Barcode or 2-D matrix code for panel identification.
Map view shows features to be processed and the tool assigned to each feature.
Flat-top beam homogenizer and zoom telescope
As an alternative to the normal Gaussian intensity profile, flat-top CO2 spots permit drilling and pocketing operations with less risk of sensitive inner layer damage and a very consistent process. The user can even switch between Gaussian and flat-top spots within the same job.
